We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Package Substrate.
ipros is IPROS GMS IPROS One of the largest technical database sites in Japan that collects information on.

Package Substrate - List of Manufacturers, Suppliers, Companies and Products

Package Substrate Product List

1~2 item / All 2 items

Displayed results

LTCC multilayer wiring board / LTCC package board KLC

For interposers and MEMS package applications! Customizable to desired shape, size, and number of layers.

KLC is a substrate, package, and interposer for modules made from LTCC (Low-Temperature Co-fired Ceramic). By specifying the desired shape, size, and number of layers, it is possible to form cavities with high flatness and dimensional accuracy, making it effective as a ceramic package for mounting bare chips. In addition to applications for interposers and MEMS packages, we actively respond to small quantity demands such as prototypes for research and development and evaluation tests for semiconductor chips. Furthermore, we can accommodate post-processing such as chip mounting, component mounting, wire bonding, resin sealing, and ball mounting using our own component mounting line, depending on your needs. *For more details, please refer to the PDF document or feel free to contact us.

  • Company:KOA
  • Price:Other
  • Printed Circuit Board

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

PWB for CSP/module

Chip size packages for various components used in mobile phones and other small devices.

The "CSP/module PWB" is a chip size package that further miniaturizes standard BGA. Using our unique technology, we manufacture packages with a three-dimensional cavity structure. By adopting electroless gold plating, it eliminates the need for plated leads, allowing for high-density wiring. The sheet structure can accommodate various forms of assembly substrates, including dicing cut method, hanging method, and push-back method. 【Features】 ■ Selection of materials with high rigidity, low dielectric constant, high heat resistance, and halogen-free options ■ High-density wiring capability ■ Sheet structure allows for various forms of assembly substrates *For more details, please refer to the catalog or feel free to contact us.

  • Printed Circuit Board
  • Other electronic parts
  • Circuit board design and manufacturing

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration