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Package Substrate - List of Manufacturers, Suppliers, Companies and Products

Package Substrate Product List

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LTCC multilayer wiring board / LTCC package board KLC

LTCC multilayer wiring board / LTCC package board KLC

For interposers and MEMS package applications! Customizable to desired shape, size, and number of layers.

KLC is a substrate, package, and interposer for modules made from LTCC (Low-Temperature Co-fired Ceramic). By specifying the desired shape, size, and number of layers, it is possible to form cavities with high flatness and dimensional accuracy, making it effective as a ceramic package for mounting bare chips. In addition to applications for interposers and MEMS packages, we actively respond to small quantity demands such as prototypes for research and development and evaluation tests for semiconductor chips. Furthermore, we can accommodate post-processing such as chip mounting, component mounting, wire bonding, resin sealing, and ball mounting using our own component mounting line, depending on your needs. *For more details, please refer to the PDF document or feel free to contact us.

  • Company：KOA
  • Price：Other
  • Printed Circuit Board

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PWB for CSP/module

PWB for CSP/module

Chip size packages for various components used in mobile phones and other small devices.

The "CSP/module PWB" is a chip size package that further miniaturizes standard BGA. Using our unique technology, we manufacture packages with a three-dimensional cavity structure. By adopting electroless gold plating, it eliminates the need for plated leads, allowing for high-density wiring. The sheet structure can accommodate various forms of assembly substrates, including dicing cut method, hanging method, and push-back method. 【Features】 ■ Selection of materials with high rigidity, low dielectric constant, high heat resistance, and halogen-free options ■ High-density wiring capability ■ Sheet structure allows for various forms of assembly substrates *For more details, please refer to the catalog or feel free to contact us.

  • Printed Circuit Board
  • Other electronic parts
  • Circuit board design and manufacturing

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Flat pushback technology

Flat pushback technology

A flat push-back board that achieves a flat finish for improved efficiency during assembly.

The "Flat Pushback Technology" provides a superior substrate during component mounting by suppressing the curvature of the sheet through advanced mold technology and our unique flat pushback sheet shape. It ensures the necessary holding force during component mounting while also being easy to separate after installation. Additionally, defective products within the sheet can be removed and replaced with good ones. 【Features】 ■ Flat shape that suppresses curvature ■ Advantageous during component mounting ■ Processing of half-cut through holes in the pushback area is also possible *For more details, please refer to the catalog or feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Other electronic parts

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Advanced dam technology

Advanced dam technology

A technology capable of forming high dams of approximately 0.1 to 0.6 mm through a unique special printing method.

Nippon Micron Co., Ltd. offers products with heat dissipation properties by applying heat spreaders using its unique metal sheet bonding technology. By bonding rigid substrates with sealing frames and rigid substrates with copper foil, it is possible to create package structures that are difficult to achieve with conventional multilayer designs. It is easy to form dams of varying heights and dimensions within the same product, and high dams of approximately 0.1 to 0.6 mm, which cannot be formed with conventional printing inks, can be created using our unique special printing method. Additionally, it eliminates gaps on the bonding surfaces that are likely to occur with adhesive-type sealing frames, allowing for batch processing unlike dispensers. 【Features】 ■ Gaps on bonding surfaces can be eliminated ■ Batch processing is possible ■ High dams can be formed using a special printing method ■ It is easy to form dams of varying heights and dimensions within the same product *For more details, please refer to the catalog or feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Other electronic parts

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